Engineering Analysis – FEA, CFD, Thermal

At EDIC Semicon, we offer advanced Engineering Analysis services including Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), and Thermal Simulations to ensure your products are robust, efficient, and ready for real-world conditions.

Core Capabilities:

• FEA (Structural Analysis):
  Evaluate stress, strain, deformation, and fatigue to validate mechanical durability and optimize design strength.
• CFD (Fluid Flow & Heat Transfer):
  Simulate fluid behavior and thermal effects for applications in cooling systems, ventilation, and flow-sensitive designs.
• Thermal Simulation:
  Analyze heat distribution and thermal performance for electronic components, enclosures, and power systems.

Tools & Platforms:

ANSYS, SolidWorks Simulation, COMSOL, Abaqus, Autodesk CFD

Benefits:

• Reduce physical prototyping costs
• Improve product reliability and safety
• Accelerate design iterations with virtual testing
• Ensure compliance with thermal and mechanical standards

Whether you’re designing electronics, automotive parts, or industrial equipment, EDIC Semicon helps you engineer smarter with simulation-driven validation